发明名称 METHOD FOR PRODUCING SEMICONDUCTOR HAVING GETTERING LAYER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 This method for producing a semiconductor having a gettering layer comprises: a film formation step for forming an impurity-containing film on one surface of a semiconductor; and a melting step for melting the semiconductor surface layer by irradiating the semiconductor with laser light from the one surface side. Since the gettering layer is produced by forming a high impurity concentration region by doping the molten semiconductor with an impurity in the melting step, the semiconductor surface layer is able to be doped with the impurity at a high concentration. By doping the molten semiconductor with the impurity at a high concentration, a high impurity concentration region is able to be formed, thereby imparting the semiconductor surface layer with gettering ability. In addition, irradiation of laser light enables processing with a low thermal load.
申请公布号 WO2015186625(A1) 申请公布日期 2015.12.10
申请号 WO2015JP65554 申请日期 2015.05.29
申请人 THE JAPAN STEEL WORKS,LTD. 发明人 SEINO TOSHIAKI;KOBAYASHI NAOYUKI;KUDO TOSHIO
分类号 H01L21/322;H01L21/02;H01L21/22;H01L21/225;H01L21/268;H01L27/12 主分类号 H01L21/322
代理机构 代理人
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