Methods for doping fin field-effect transistors

摘要

A method of doping a FinFET includes forming a semiconductor fin on a substrate, the substrate having a first device region and a second device region. The semiconductor fin is formed on a surface of the substrate in the second device region and has a top surface and sidewalls. The first device region is covered with a hard mask and the semiconductor fin and the hard mask are exposed to a deposition process to form a dopant-rich layer having an n-type or p-type dopant on the top surface and the sidewalls of the semiconductor fin. The dopant from the dopant-rich layer is diffused into the semiconductor fin by performing an annealing process in which the first device region is free of diffusion of the diffused dopant or another dopant from the hard mask.

主权项

1. A method of doping a fin field-effect transistor (FinFET), the method comprising:
forming a semiconductor fin on a substrate, the substrate comprising a first device region and a second device region, the semiconductor fin being formed on a surface of the substrate in the second device region, wherein the semiconductor fin has a top surface and sidewalls; covering the first device region with a hard mask; exposing the semiconductor fin and the hard mask to a deposition process to form a dopant-rich layer comprising an n-type or a p-type dopant on the top surface and the sidewalls of the semiconductor fin; diffusing the dopant from the dopant-rich layer into the semiconductor fin by performing an annealing process, wherein the first device region of the substrate is free of diffusion of the diffused dopant or another dopant from the hard mask; and forming a gate stack over a portion of the top surface and the sidewalls.