| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has no size constraints in semiconductor element to be mounted while achieving downsizing of the device.SOLUTION: A semiconductor device comprises: a diode D1 which has a surface anode region 10A and which is mounted on a P pattern 5; and a diode D2 which has a surface cathode region 20K and which is mounted on an N pattern 6. The diodes D1 and D2 are formed in a manner such that a first vertically-structured relationship of the surface anode region 10A against the corresponding cathode region and a second vertically-structured relationship of the surface cathode region 20K against a corresponding anode region coincide with each other on the upper side. The surface anode region 10A and the surface cathode region 20K are electrically connected by a wire 25 provided on the upper side. |
