WATERPROOF STRUCTURE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a waterproof structure for an electronic component capable of achieving effective waterproofness and of facilitating manufacture without increasing the number of components and the number of assembly steps.SOLUTION: Provided is an electronic component 1-1 in which an upper part of a first circuit board 31 is covered with a case 130, and a functional component such as a slider 90 is housed in a functional component housing space C1 formed by the first circuit board 31 and the case 130. A seal layer 43 is provided by applying coating having elasticity after hardening at a position surrounding the circumference of the functional component housing space C1 on an upper surface of the first circuit board 31. An abutting surface 138 is provided at a position opposed to the seal layer 43 of the case 130. Sealing and waterproofing is performed by making the abutting surface 138 abut on the upper surface of the seal layer 43.