发明名称 METHOD FOR SPLITTING BRITTLE SUBSTRATE
摘要 Sliding motion of a cutting edge (51) is used to cause plastic deformation in a first surface (SF1) of a brittle substrate (4) and form a trench line (TL). Said trench line (TL) is formed in such a manner so as to produce a crack-free state in which, directly underneath the trench line (TL), the brittle substrate (4) is connected in a continuous fashion in a direction that intersects the trench line (TL). Said crack-free state is then maintained. Next, a crack is made to extend in the thickness direction through the brittle substrate (4) along the trench line (TL), forming a crack line (CL), and the brittle substrate (4) is split along said crack line (CL).
申请公布号 WO2015182241(A1) 申请公布日期 2015.12.03
申请号 WO2015JP60199 申请日期 2015.03.31
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 SOYAMA HIROSHI
分类号 C03B33/037;B28D5/00 主分类号 C03B33/037
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