| 摘要 |
The invention relates to a method for coating substrates by sputtering of target material, the method comprising the following steps: - applying a first sputtering target made of a first material in a coating chamber to a power pulse by which, during a first time interval, a first amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50W/cm2 and preferably 500W/cm2; - applying a second sputtering target made of a second material that is different from the first material in the coating chamber to a power pulse by which, during a second time interval, a second amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50W/cm2 and preferably 500W/cm2, characterized in that the first amount of energy differs from the second amount of energy. |
