发明名称 |
WAFER EDGE DETECTION AND INSPECTION |
摘要 |
Methods and systems for determining wafer inspection coordinates for fixed location(s) on a wafer are provided. One system includes an illumination subsystem configured to direct light to a spot on an edge of a wafer. The spot extends beyond the edge of the wafer. The system also includes a stage that rotates the wafer thereby causing the spot to be scanned over the edge of the wafer. The system also includes a detector configured to detect light from the spot while the spot is being scanned over the edge and to generate output responsive thereto. The system further includes a computer processor configured to determine wafer inspection coordinates of two or more locations on the edge of the wafer based on the output and to determine wafer inspection coordinates of fixed location(s) on the wafer based on the wafer inspection coordinates of the two or more locations on the edge. |
申请公布号 |
WO2015179233(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
WO2015US31051 |
申请日期 |
2015.05.15 |
申请人 |
KLA-TENCOR CORPORATION |
发明人 |
MALEEV, IVAN;KODE, VENKATA |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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