SYSTEMS FOR ENCAPSULATING A HYBRID ASSEMBLY OF ELECTRONIC COMPONENTS AND ASSOCIATED METHODS

摘要

During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

主权项

1. An encapsulation system for encapsulating a hybrid assembly, the hybrid assembly including a substrate having a first side and a second opposing side, the system comprising:
a mold assembly including a molding cavity and a trench, the hybrid assembly being disposed within the molding cavity and the trench such that the first side of the substrate is disposed within the molding cavity and the second side of the substrate is disposed within the trench, wherein a majority of the first and second sides of the hybrid assembly is configured to be offset from a first surface of the first mold chase and a second surface of the second mold chase to define a gap therebetween; a mold conduit in fluid communication with the molding cavity, the mold conduit being configured to deliver mold material into the molding cavity, wherein a perimeter of the hybrid assembly is substantially in contact with an interior perimeter of the molding cavity to contain the mold material within the molding cavity; a fluid conduit in fluid communication with the trench, the fluid conduit being configured to deliver a fluid into the trench; a regulator configured to receive a parameter indicative of a first pressure generated by the mold material against the first surface and to control delivery of the fluid into the trench such that the fluid generates a second pressure against the second surface that is substantially equal to the first pressure.