| 摘要 |
PROBLEM TO BE SOLVED: To prevent deformation of a board, without limiting the degree of freedom of layout of electronic components on the board, and the degree of freedom of layout of interlayer wiring in the board, as much as possible, in a half mold type electronic device using a multilayer board produced by laminating a plurality of resin layers.SOLUTION: Each resin layer 11-13 is formed by sealing the opposite sides of a glass cloth 1 with resin 2. An electronic component 20 is mounted on one surface 10a of a multilayer board 10, and a mold resin 30 seals the one surface 10a. In a component projection part 10c located in a projection region of the electronic component 20 on one surface 10a of the multilayer board 10, out of the multilayer board 10, a deformation prevention layer 17, composed of a material having a linear coefficient of expansion smaller than that of the resin 2, is embedded in the resin 2 of the first resin layer. Entirety of the deformation prevention layer 17 is located on the farther inner side of the resin 2 than the front and rear layer surfaces 11a, 11b in the first resin layer 11. |
