| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate and a manufacturing method of the same, which can improve adhesion of a core base material and a wiring pattern layer in a semiconductor package substrate using glass as the core base material, and which ease constraints of a wiring pattern layer due to diameters of a through hole and a land.SOLUTION: In a wiring board manufacturing method, by laminating a stress relaxation adhesion layer 3 and forming a via 4 on a core base material 1 after forming a through hole electrode 2 on the core base material 1, a diameter of a land 5 on the stress relaxation adhesion layer 3 is made smaller than a diameter of a through hole 2. |
