CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

摘要

A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

主权项

1. A manufacture comprising:
a first structure comprising one or more contact pads; one or more electrically conductive connections each of which has a bottom attached to at least one contact pad and comprises solder; and a first layer comprising a top surface and one or more through-holes in the top surface, each through-hole's sidewall being a dielectric sidewall, each through-hole containing at least a segment of a corresponding electrically conductive connection, the segment physically contacting the through-hole's dielectric sidewall, the electrically conductive connection being recessed in the through-hole at the top of the through-hole.