| 发明名称 |
SUBSTRATE, SEMICONDUCTOR PACKAGE THEREOF AND PROCESS OF MAKING SAME |
| 摘要 |
A substrate, a semiconductor package thereof and a process of making the same are provided. The substrate comprises an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned. |
| 申请公布号 |
US2015318235(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201514704769 |
申请日期 |
2015.05.05 |
| 申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN Tien-Szu;WANG Sheng-Ming;CHEN Kuang-Hsiung;LEE Yu-Ying |
| 分类号 |
H01L23/498;H01L23/495;H01L21/77 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate, comprising an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad, and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned. |
| 地址 |
Kaohsiung TW |
