| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board which has excellent ability of radiating heat from components mounted thereon, and to provide a manufacturing method of the printed circuit board.SOLUTION: A printed circuit board includes: a core substrate 2 where a wiring pattern 4 is formed on at least one surface of an insulation plate 1; an insulation resin layer 21a laminated on a surface of the core substrate 2; a storage part 11 which is a through hole penetrating through the core substrate 2 and the insulation resin layer 21a; and a metal small piece 40 stored in the storage part 11. Further, the printed circuit board includes a conductor 27, which supports the metal small piece 40, when one surface of the storage part 11 is an upper surface, on the other surface side of the storage part 11 so as to prevent the metal small piece 40 stored from the one surface into the storage part 11 from dropping from the other surface. |
