| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing system, having the substrate processing device incorporated therein, capable of performing stable coating processing with an improved throughput.SOLUTION: A substrate folder 90 which holds a plurality of substrates S at a retention region 91 is loaded on a stage 3. A plurality of suction holes 72 are formed on the loading surface 30 of the stage 3. The suction holes 72 communicate with a vacuum pump 751. A substrate holder 90 includes a recess 911 as the retention region 91. A plurality of through holes 913 are formed on a bottom surface BT of the recess 911. When the substrate holder 90 is loaded on the stage 3, a suction path 75 which communicates with the vacuum pump 751 is formed by the suction hole 72 and the through hole 913. Processing liquid is coated in a state that the plurality of substrates S are absorbed and held on the substrate holder 90 through the suction path 75. |
