发明名称 |
RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONIC DEVICE WITH A RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE |
摘要 |
A reconfigurable high speed memory chip module includes a type of memory cell array group, a first transmission bus, and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs). The first transmission bus coupled to the type memory cell array group has a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing, a first programmable bus width, and a combination thereof. The logic unit is coupled to the first transmission bus for accessing the type memory cell array group through the first transmission bus. |
申请公布号 |
US2015317276(A1) |
申请公布日期 |
2015.11.05 |
申请号 |
US201514800682 |
申请日期 |
2015.07.15 |
申请人 |
Etron Technology, Inc. |
发明人 |
Ken Weng-Dah;Lu Chao-Chun;Sung Jan-Mye |
分类号 |
G06F13/42;G11C8/18;G11C5/06 |
主分类号 |
G06F13/42 |
代理机构 |
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代理人 |
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主权项 |
1. A reconfigurable high speed memory chip module, comprising a type of memory cell array group, wherein the type of memory cell array group comprises multiple memory cell array integrated circuits (ICs);
a first transmission bus coupled to the type of memory cell array group having a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing; and a logic unit coupled to the first transmission bus for accessing the type of memory cell array group through the first transmission bus. |
地址 |
Hsinchu TW |