发明名称 RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONIC DEVICE WITH A RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE
摘要 A reconfigurable high speed memory chip module includes a type of memory cell array group, a first transmission bus, and a logic unit. The type memory cell array group includes multiple memory cell array integrated circuits (ICs). The first transmission bus coupled to the type memory cell array group has a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing, a first programmable bus width, and a combination thereof. The logic unit is coupled to the first transmission bus for accessing the type memory cell array group through the first transmission bus.
申请公布号 US2015317276(A1) 申请公布日期 2015.11.05
申请号 US201514800682 申请日期 2015.07.15
申请人 Etron Technology, Inc. 发明人 Ken Weng-Dah;Lu Chao-Chun;Sung Jan-Mye
分类号 G06F13/42;G11C8/18;G11C5/06 主分类号 G06F13/42
代理机构 代理人
主权项 1. A reconfigurable high speed memory chip module, comprising a type of memory cell array group, wherein the type of memory cell array group comprises multiple memory cell array integrated circuits (ICs); a first transmission bus coupled to the type of memory cell array group having a first programmable transmitting or receiving data rate, a first programmable transmitting or receiving signal swing; and a logic unit coupled to the first transmission bus for accessing the type of memory cell array group through the first transmission bus.
地址 Hsinchu TW
您可能感兴趣的专利