| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle which, when a connection structure is obtained by connecting between electrodes, hardly increases connection resistance between the electrodes even if the connection structure is exposed to high temperature and high humidity, and to provide a connection structure using the conductive particle.SOLUTION: There is provided a conductive particle which comprises a substrate particle 2, a copper layer 3 provided on the surface 2a of the substrate particle 2 and a palladium layer 4 provided on the surface of the copper layer 3. The palladium layer 4 has an average thickness of 5 to 500 nm. A copper ion concentration eluted when 100 pts.wt. of a plurality of conductive particles 1 are immersed in 1000 pts.wt. of 0.001 N nitric acid for one minute at 25°C is 5 ppm/cmor less per unit surface area of the conductive particle 1. |
