| 发明名称 | Chip package and method for forming the same | ||
| 摘要 | A chip package including a first substrate having a first surface and a second surface opposite thereto is provided. The first substrate has a micro-electric element and a plurality of conducting pads adjacent to the first surface. The first substrate has a plurality of openings respectively exposing a portion of each conducting pad. A second substrate is disposed on the first surface. An encapsulation layer is disposed on the first surface and covers the second substrate. A redistribution layer is disposed on the second surface and extends into the openings to electrically connect the conducting pads. | ||
| 申请公布号 | US9177919(B2) | 申请公布日期 | 2015.11.03 |
| 申请号 | US201414540460 | 申请日期 | 2014.11.13 |
| 申请人 | XINTEC INC. | 发明人 | Liu Chien-Hung;Wen Ying-Nan |
| 分类号 | H01L23/00;H01L23/538;H01L23/28 | 主分类号 | H01L23/00 |
| 代理机构 | Liu & Liu | 代理人 | Liu & Liu |
| 主权项 | 1. A chip package, comprising: a first substrate having a first surface and a second surface opposite thereto, wherein the first substrate has a micro-electric element and a plurality of conducting pads adjacent to the first surface, and wherein the first substrate has a plurality of openings respectively exposing a portion of each of the plurality of conducting pads; a second substrate disposed on the first surface; an encapsulation layer disposed on the first surface and covering the second substrate; and a redistribution layer disposed on the second surface and extending into the plurality of openings to electrically connect the plurality of conducting pads. | ||
| 地址 | Taoyuan TW | ||