发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To enhance accuracy of interlock control.SOLUTION: A CMP device includes a plurality of components used for processing a substrate, a housing 1 for housing the plurality of components, a plurality of identification members 312A, 314A, 316A provided in the housing 1 and different from the plurality of components, an image pickup section 320A provided in the door 35A of the housing 1 on the inside thereof, and an operation control section 330 for stopping operation of the plurality of components, when the plurality of identification members 312A, 314A, 316A are not included in the images captured by the image pickup section 320A.
申请公布号 JP2015192012(A) 申请公布日期 2015.11.02
申请号 JP20140067876 申请日期 2014.03.28
申请人 EBARA CORP 发明人 MITANI RYUICHIRO
分类号 H01L21/304;B24B49/12;B24B51/00;H01L21/306 主分类号 H01L21/304
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