Trimming of dummy fill shapes holes to affect near-neighbor dummy fill shapes with built-in optical proximity corrections for semiconductor applications

摘要

Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections (OPCs) for semiconductor applications is provided. A method for the near-neighbor trimming includes adding one or more hole shapes onto a semiconductor design layout comprising a plurality of design shapes. The method further includes trimming adjacent ones of the plurality of which are covered by the one or more hole shapes.

主权项

1. A computer program product comprising a computer usable storage medium having readable program code embodied in the storage medium, the computer program product includes at least one component operable to:
place at least one set of design shapes in a first region of a semiconductor design or test layout; place a plurality of sets of design shapes in a second region of the semiconductor design or test layout, the plurality of sets of design shapes being one of nested and semi-nested from each other, and the first region being isolated from the second region; wherein the at least one set of design shapes in the first region and the plurality of sets of design shapes in the second region comprise dummy fill unit cells; adjust one of the dummy fill unit cells by adding one or more hole shapes onto the dummy fill unit cell such that the one or more hole shapes partially or fully cover and trim shapes in an adjacent one of the dummy fill unit cells; output the dummy fill unit cell for use in the semiconductor design or test layout; save the dummy fill unit cell for use in a different semiconductor design; and use the dummy fill unit cell in the different semiconductor design.