MOLD ATTACHING METHOD TO MOLD CLAMPING DEVICE

摘要

When a plurality of sets of molds, spaced a predetermined distance along a circumferential direction of a rotary platen, are attached through predetermined clamp portions to a mold attachment surface of the rotary platen supported by a movable platen included in a mold clamping device and a mold attachment surface of a fixed platen opposite this mold attachment surface, at least a mold clamping force, when the mold is attached, is previously limited to a limited mold clamping force lower than a mold clamping force at the time of molding. A mold attaching mode is set that has an interlock function of preventing the limitation from being cancelled until a condition under which all the clamp portions are turned on is satisfied. The selected mold attaching mode is performed when the molds are attached and the plurality of sets of molds are sequentially attached set by set.

主权项

1. A mold attaching method to a mold clamping device in which a plurality of sets of molds spaced a predetermined distance along a circumferential direction of a rotary platen are attached through predetermined clamp portions to a mold attachment surface of the rotary platen supported by a movable platen included in the mold clamping device and a mold attachment surface of a fixed platen opposite this mold attachment surface,
wherein at least a mold clamping force when the mold is attached is previously limited to a limited mold clamping force lower than a mold clamping force at a time of molding, a mold attaching mode is set that has an interlock function of preventing the limitation from being cancelled until a condition under which all the clamp portions are turned on is satisfied, the selected mold attaching mode is performed when the mold is attached and the plurality of sets of molds are sequentially attached set by set.