METHOD FOR CONTROL OF ADHERENCE OF MICROPARTICLES TO BASE MATERIAL TO BE PROCESSED, AND PROCESSING DEVICE

摘要

The present invention includes the following steps: a step in which prior to loading a base material to be processed into a processing vessel, voltage is applied in the processing vessel to an electrostatic chuck that electrostatically adsorbs to the base material to be processed; and a step in which after voltage has been applied to the electrostatic chuck, the base material to be processed is conveyed into the processing vessel. In the step for applying voltage to the electrostatic chuck, voltage is applied to the electrostatic chuck so as to reduce the difference in potential between a focus ring disposed so as to surround the electrostatic chuck and the base material to be processed.