发明名称 |
IN-MOLD MOLDING METHOD, IN-MOLD TRANSFER FILM AND MANUFACTURING METHOD THEREFOR |
摘要 |
An in-mold molding method of the present invention is a method including: placing an in-mold transfer film in the cavity of an injection molding mold, the in-mold transfer film having a hard coating layer and a transfer section of a printed layer; and peeling, from the base material film of the in-mold transfer film, the transfer section transferred to a molding resin when a molding molded by injecting the molding resin into the cavity is removed by mold opening. The hard coating layer is ruptured in a mold opening process while the in-mold transfer film has a necessary elongation of A % on the side of the molding and the hard coating layer has a rupture elongation of at least A %+2% and less than A %+40% on the side of the molding. With this configuration, the in-mold transfer film can be stably peeled during in-mold molding. |
申请公布号 |
US2015290852(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201314441442 |
申请日期 |
2013.09.19 |
申请人 |
PANASONIC CORPORATION |
发明人 |
Nakagawa Takashi;Yoshinaga Mitsuhiro |
分类号 |
B29C45/14;B29B11/00;B29C45/72 |
主分类号 |
B29C45/14 |
代理机构 |
|
代理人 |
|
主权项 |
1. An in-mold molding method comprising:
a preheating step of preheating an in-mold transfer film having a release layer, a hard coating layer, and a printed layer on a base material film; a placing step of placing the in-mold transfer film in a cavity of an injection molding mold; a clamping step of clamping the injection molding mold; an injecting step of injecting a molding resin into the cavity containing the in-mold transfer film; and a mold opening step of opening the injection molding mold so as to obtain a molding having a transfer surface where the hard coating layer and the printed layer peeled from the base material film are transferred, wherein the in-mold transfer film has a necessary elongation of A % on a side of the molding, and the hard coating layer is ruptured in the mold opening step while the hard coating layer has a rupture elongation of at least A %+2% and less than A %+40% on the side of the molding. |
地址 |
Osaka JP |