| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
Provided is a method of manufacturing a semiconductor package including a through wiring having precision and a low process defect. The method of manufacturing the semiconductor package includes preparing a conductive member; forming a plane part and projection parts projected from the plane part by removing portions of the conductive member; arranging the conductive member and a semiconductor chip, and forming a sealing member sealing the semiconductor chip and the conductive member; forming through wirings by exposing the projection parts of the conductive member from the sealing member; forming a re-wiring pattern layer which electrically connects the through wirings and the semiconductor chip; and forming external connection members which are electrically connected to the re-wiring pattern layer. |
| 申请公布号 |
US2015287681(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201214389763 |
申请日期 |
2012.04.06 |
| 申请人 |
NEPES CO., LTD. |
发明人 |
Soh Say Hean;Siew Yuen Zien;Wong Chuan Wei;Soh Siew Boon;Chen Haoyang |
| 分类号 |
H01L23/538;H01L21/683;H01L25/065;H01L21/3213;H01L25/00;H01L21/3105;H01L21/321;H01L21/02;H01L21/56;H01L21/768 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor package, comprising:
preparing a conductive member; forming a plane part and projection parts projected from the plane part by removing portions of the conductive member; arranging the conductive member and a semiconductor chip, and forming a sealing member sealing the semiconductor chip and the conductive member; forming through wirings by exposing the projection parts of the conductive member from the sealing member; forming a re-wiring pattern layer which electrically connects the through wirings and the semiconductor chip; and forming external connection members which are electrically connected to the re-wiring pattern layer. |
| 地址 |
Eumseong-gun, Chungcheongbuk-do KR |
