| 摘要 |
The present invention relates to a light emitting diode package. According to an embodiment of the present invention, the light emitting diode package includes: a lead frame including first and second lead members separated from each other; a light emitting diode chip placed on the lead frame; a package body supporting the first and second lead members, and including an electrode separation part placed between the first and second lead members; and a reinforcing part formed on an upper surface of the electrode separation part to reinforce the electrode separation part. According to the present invention, since the electrode separation part, weak against a shock, is reinforced by using the reinforcing part, the entire height of the light emitting package is able to be shorter than 1 t, and therefore, a light emitting diode package, having a small size but high brightness, is able to be manufactured. |
