| 发明名称 | Collapsible chimney for electronic device | ||
| 摘要 | In one embodiment a housing for an electronic device comprises a first section, a second section, and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section. Other embodiments may be described. | ||
| 申请公布号 | US9152190(B2) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201213710819 | 申请日期 | 2012.12.11 |
| 申请人 | Intel Corporation | 发明人 | Heymann Douglas;Wikander Jered H.;MacDonald Mark |
| 分类号 | G06F1/20;H05K7/20;G06F1/16 | 主分类号 | G06F1/20 |
| 代理机构 | Alpine Technology Law Group LLC | 代理人 | Alpine Technology Law Group LLC |
| 主权项 | 1. A housing for an electronic device, comprising: a first section; a second section; and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section, wherein the collapsible chimney comprises: a base proximate the first section, the base having a first cross sectional area andan opening distal the base, the opening having a second cross sectional area, less than the first cross sectional area. | ||
| 地址 | Santa Clara CA US | ||