| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having a high-output semiconductor element and a cooling device in which heat emitted from the semiconductor element and an electrode portion can be efficiently heat-exchanged and cooled by an electrode structure for fixing the semiconductor element to be mounted.SOLUTION: A plate 2 in which a conductor layer is formed on a surface layer portion on the upper surface of ceramic material on which a semiconductor element 1 is mounted is pinched by a cooling block for cooling the plate, a power supply electrode terminal 41, an insulation sheet and a ground electrode terminal 31, and the ground electrode terminal 31 and the power supply electrode terminal 41 have the same shape. The above structure enables heat emitted from the semiconductor element and the electrode portion to be efficiently heat-exchanged and cooled.</p> |
