| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting state inspection device and a mounting state inspection method which are capable of reducing burden on an operator when the operator performs the quality determination of the mounting state of an electronic component, and enhancing the support for the quality determination of the mounting state of an electronic component performed by an operator.SOLUTION: A mounting state inspection device automatically inspects the mounting state of an electronic component 3 on the basis of an image to be inspected 47 of a mounting position acquired by an inspection camera, and performs a secondary inspection when the mounting state is determined to be in a bad state. In the secondary inspection, an input of a determination result of a visual inspection by an operator is accepted, the secondary inspection being executed in the state in which the image to be inspected 47 and a sample image 48 are displayed on a secondary inspection screen 36a. At this time, a secondary inspection section displays, on the secondary inspection screen 36a, as the sample image 48, a first sample image 48a or a second sample image 48b which is stored in a sample image storage section according to the request of the operator.</p> |
