EMBEDDED CIRCUIT PATTERNINGG FEATURE SELECTIVE ELECTROLESS COPPER PLATING

摘要

Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.

主权项

1. A method for metallizing a dielectric layer, comprising:
patterning the dielectric layer to form one or more patterned surfaces on the dielectric layer; selectively forming a seed layer on the one or more patterned surfaces of the dielectric layer; and exposing the dielectric layer to an electroless plating bath comprising metal ions and a reducing agent, wherein the seed layer is a catalyst that allows the reducing agent to reduce the metal ions, thereby selectively depositing the metal ions on surfaces of the dielectric layer where the seed layer is formed.