发明名称 |
Flexible Printed Circuits With Bend Retention Structures |
摘要 |
An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit. |
申请公布号 |
US2015282304(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201414226593 |
申请日期 |
2014.03.26 |
申请人 |
Apple Inc. |
发明人 |
Ely Colin M.;Shedletsky Anna-Katrina;Rothkopf Fletcher R.;Lynch Stephen Brian |
分类号 |
H05K1/02;H05K1/03;H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A flexible printed circuit having a bend, comprising:
flexible printed circuit layers including metal traces; and a bend retention structure that is attached to the flexible printed circuit layers at the bend and that retains the flexible printed circuit layers in a bent configuration to maintain the bend. |
地址 |
Cupertino CA US |