SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which chipping on a rear surface and warpage of a wafer can be prevented, and to provide a manufacturing method thereof.

SOLUTION: The semiconductor device is provided with a semiconductor layer having a first main surface, a second main surface provided on a side opposite to the first main surface and a channel forming region provided on a surface layer of the first main surface side; and a first main electrode provided on an inner side than a dicing street on the first main surface of the semiconductor layer; a second main electrode provided on an inner side than a dicing street in the second main surface of the semiconductor layer; and a control electrode opposite to the channel forming region via an insulating film.

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