| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package that improves the problem wherein the junction strength of the package cannot be maintained since thermal stress is applied in welding and sealing due to the difference in the thermal coefficient of expansion between a vessel and a lid and hence distortion remains, and reduces the height of the package. SOLUTION: The vessel is formed by a process for coating a glass plate with a polyimide resin for curing, a process for forming a via in the resin, a process for performing aluminum film formation on the resin, forming a pattern by exposure and development, separating resist, and separating the glass, a process for inverting the formed resin for bonding onto the glass plate again, a process for performing the aluminum film formation on the rear of the resin to form an electrode making continuity with the via by exposure and development, and a process for separating from the glass plate. COPYRIGHT: (C)2008,JPO&INPIT
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