发明名称 RESIN MOLDED PART FOR SIGNAL READOUT DEVICE AND METHOD FOR MOLDING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin molded part for a signal readout device, having light weight, capable of realizing improvement of vibration damping characteristics and frequency increase in resonance frequencies, and excellent in heat dissipation. <P>SOLUTION: This resin molded part for the signal readout device is formed out of 55-75 wt% of a liquid crystalline polymer (A), 20-10 wt% of inorganic spherical hollow bodies (B1), and 25-15 wt% of a fibrous inorganic filler (B2) and has a specific gravity (d) of &le;1.4, a coefficient of thermal conductivity (&lambda;) of &ge;0.5 W/m&times;K, and a modulus in flexure of &ge;10 GPa, wherein the liquid crystalline polymer (A) is composed of structural units expressed by general formula (I) (Ar<SB>1</SB>is 2,6-naphthalene), general formula (II) (Ar<SB>2</SB>is selected from 1,2-phenylene, 1,3-phenylene and 1,4-phenylene), general formula (III) (Ar<SB>3</SB>is selected from 1,3-phenylene, 1,4-phenylene and p,p'-polyphenylene), and general formula (IV) (Ar<SB>4</SB>is 1,4-phenylene). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006152120(A) 申请公布日期 2006.06.15
申请号 JP20040344680 申请日期 2004.11.29
申请人 POLYPLASTICS CO 发明人 FUKATSU HIROKI
分类号 C08L101/12;B29C45/00;B29K67/00;B29K509/00;B29L31/34;C08K7/04;C08K7/24;C08L67/00 主分类号 C08L101/12
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