发明名称 |
QUICK-DRYING ETCHING RESIST INK COMPOSITION FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD, AND PRINTING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an etching resist ink composition for manufacturing an electronic circuit board in which a film can be formed in a short time on a copper clad multilayer board or an electronic circuit board without using extra equipment or material. <P>SOLUTION: Immediately after printing on an article (a copper clad multilayer board or an electronic circuit board) using a nonaqueous etching resist ink composition containing a water soluble solvent and a water insoluble solvent where a printed part dries up quickly through contact with water, the article is touched to water thus forming an etching resist film or a marking. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2005051056(A) |
申请公布日期 |
2005.02.24 |
申请号 |
JP20030281722 |
申请日期 |
2003.07.29 |
申请人 |
FUJI PRINT KOGYO KK;MAKII ENGINEERING KK;NEW TECHNOLOGY MANAGEMENT CO LTD |
发明人 |
ARAI MASUMI;KAMIYA YASUHITO;OTSUBO YASUBUMI;EDAMURA KAZUYA |
分类号 |
C09D11/033;C09D11/10;C09D11/106;C09D11/107;C09D11/108;C09D11/30;H05K3/06;(IPC1-7):H05K3/06 |
主分类号 |
C09D11/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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