发明名称 QUICK-DRYING ETCHING RESIST INK COMPOSITION FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD, AND PRINTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an etching resist ink composition for manufacturing an electronic circuit board in which a film can be formed in a short time on a copper clad multilayer board or an electronic circuit board without using extra equipment or material. <P>SOLUTION: Immediately after printing on an article (a copper clad multilayer board or an electronic circuit board) using a nonaqueous etching resist ink composition containing a water soluble solvent and a water insoluble solvent where a printed part dries up quickly through contact with water, the article is touched to water thus forming an etching resist film or a marking. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005051056(A) 申请公布日期 2005.02.24
申请号 JP20030281722 申请日期 2003.07.29
申请人 FUJI PRINT KOGYO KK;MAKII ENGINEERING KK;NEW TECHNOLOGY MANAGEMENT CO LTD 发明人 ARAI MASUMI;KAMIYA YASUHITO;OTSUBO YASUBUMI;EDAMURA KAZUYA
分类号 C09D11/033;C09D11/10;C09D11/106;C09D11/107;C09D11/108;C09D11/30;H05K3/06;(IPC1-7):H05K3/06 主分类号 C09D11/033
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