| 摘要 |
PURPOSE:To polish a silicone wafer at a uniform thickness by pressing a mount plate to a surface plate with a mount head via a spiral elastic tube filled with a liquid in it in a polishing device of the silicone wafer or the like. CONSTITUTION:A silicone wafer 4 is fixed on the lower face of a mount plate 2, which is mounted on a surface plate 1. Next,when a pressure shaft 5a is pressed downward, a mount head 3a presses the liquid 8 in the spiral elastic tube 6 of an elastic tube forming body 7 via its inner plane,and the pressurized liquid 8 presses the upper face of the mount plate 2 via the elastic tube forming body 7. When the silicone wafer 4 is pressed to the upper face of the surface plate 1 and the surface plate 1 is rotated under this condition, the silicon wafer 4 is polished while being revolved and rotated. Accordingly, the pressure applied between the silicone wafer and the surface plate is made uniform, and the silicone wafer can be polished at a uniform thickness. |
