CURED EPOXY RESIN ENCAPSULATING COMPOSITIONS

摘要

Electrical/electronic encapsulating compounds are prepared from reinforced epoxy resin compositions comprising (A) a filler material such as silica flour, (B) one or more epoxy resins at least one of which is a hydrocarbon novolac epoxy resin such as a phenol-dicyclopentadiene epoxy novolac resin and (C) one or more epoxy resin curing agents such as phenolformaldehyde novolac resin. These compositions are particularly suitable for use in electrical applications such as the encapsulation and subsequent protection of electrical and micro electronic devices and circuitry.