| 摘要 |
PROBLEM TO BE SOLVED: To provide a template for forming solder bumps, a method of manufacturing the template, and to provide a method of inspecting the solder bumps by using the template. SOLUTION: The template 20 for forming the solder bumps can include a transparent substrate 22 on which a plurality of cavities 22a are formed at an upper surface thereof, and a light-reflective film 24 and a protection film 26 formed on the lower surface of the transparent substrate 22. When a nozzle is brought into close contact with the template 20 to inject molten solder into the cavities 22a, damage to the template 20 may be prevented by the light-reflective film 24 and the protection film 26. Thereby, the lifetime of the template 20 may be sharply extended. An inspection step of solder bumps formed in the cavities 22a of the template 20 can be easily performed by analyzing light reflected by the light-reflective film 24. COPYRIGHT: (C)2009,JPO&INPIT
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