Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a semiconductor chip. The conductor structure has a first site electrically connected to a first redistribution layer structure and a second site electrically connected to a second redistribution layer structure. A solder structure is formed on the conductor structure.
申请公布号
WO2009071982(A3)
申请公布日期
2009.07.23
申请号
WO2008IB03343
申请日期
2008.12.04
申请人
ATI TECHNOLOGIES ULC;ATI INTERNATIONAL SRL;MCLELLAN, NEIL;LI, YUE;TOPACIO, RODEN;CHEUNG, TERENCE