| 摘要 |
A method of forming an Sn-Ag-Cu ternary alloy thin-film of the present invention forms the ternary alloy thin-film by electroplating. A plating bath contains an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is one of a polymerized phosphate-based chelating agent and a chelating agent represented by a chemical formula (I): MFX(X-Y)- . . . (I) where M is an arbitrary metal, X is an arbitrary natural number and Y is an oxidation number of M. The organic chelating agent is one of porphyrins, dipivaloylmethane, phthalocyanines and a compound represented by a chemical formula (II): R-(CH2CH2O)n-A . . . (II) where R is an alkyl group having a carbon number of 8 to 30, A is CH2COONa or CH2SO4Na and n is a natural number.
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