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发明名称
利用装卸站用以研磨半导体晶圆之研磨装置与方法
摘要
一种用以研磨半导体晶圆之研磨装置及方法,使用多重装卸站以及至少一翻转机器人晶圆处理装置以处理该等晶圆,使得该晶圆可于多重研磨台上被研磨。该翻转机器人晶圆处理装置操作以使该晶圆翻转,使得该等晶圆之一侧可于一第一研磨台上被研磨以及该等晶圆之另一侧可接着于一第二研磨台上被研磨。
申请公布号
TW200922746
申请公布日期
2009.06.01
申请号
TW097134073
申请日期
2008.09.05
申请人
伊诺普拉股份有限公司
发明人
丁寅权
分类号
B24B37/04(2006.01);H01L21/304(2006.01)
主分类号
B24B37/04(2006.01)
代理机构
代理人
何金涂;王彦评
主权项
地址
美国
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