发明名称 CIRCUIT APPARATUS
摘要 PROBLEM TO BE SOLVED: To miniaturize a circuit apparatus while obtaining a radiation effect even if a heat sink is not arranged. SOLUTION: A terminal 4 is disposed to pass on an element 3. Thus, an arrangement space of the terminal 4 and the element 3 can be shared. The arrangement space can effectively be used compared to the case that the terminal 4 and the element 3 are disposed in completely different places. Thus, the substrate 2 can be miniaturized, and the circuit apparatus 1 can be miniaturized. A distance from a parallel part 4a of the terminal 4 to the upper face of the element 3 or a distance from a vertical part 4b of the terminal 4 to the side face of the element 3 is brought close. Thus, radiation is enabled with the terminal 4 as the heat sink. Consequently, the radiation effect can be obtained even if the heat sink is not disposed in the element 3. The number of components can be reduced compared to the case that the heat sink is installed, and the circuit apparatus 1 can be miniaturized. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009081180(A) 申请公布日期 2009.04.16
申请号 JP20070247591 申请日期 2007.09.25
申请人 DENSO CORP;DENSO TRIM KK 发明人 MORISHITA KOJI;OKUOKA YUTO
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址