| 摘要 |
Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
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