| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a constitution that a semiconductor element is disposed in a hollow sealing member, which can effectively prevent the detachment of a sealing member on the bonding face at mounting, also prevent the occurrence of dew condensation in a hollow space, and ensure long term reliability after mounting. SOLUTION: The semiconductor device comprises a semiconductor element 1, a lead frame 2 to which the semiconductor element 1 is mounted, and a sealing member 3 for sealing the semiconductor element 1. The sealing member 3 has a hollow frame body 5 having one end opened, and a cap 6 for closing the opening of the frame body 5. The semiconductor element 1 is housed in the sealing member 3, the lead frame 2 is led to the outside of the sealing member 3, and a vent groove 7 is formed at the edge of the frame 5 at the open side passing therethrough. The groove 7 is sealed with a sealing plug 11 after the lead frame 2 is fixed to a mounting substrate 14. COPYRIGHT: (C)2009,JPO&INPIT |
