| 摘要 |
PROBLEM TO BE SOLVED: To suppress the variation of bonding strength when bonding a piezoelectric vibration chip to a base. SOLUTION: A crystal vibrator 1 is provided with: a support material 5 for holding a crystal vibration chip 2; the base 3 for holding the crystal vibration chip 2 through the support material 5; and a lid 4 bonded with the base 3 so as to airtightly seal the crystal vibration chip 2 held by the base 3. Then, the support material 5 is bump-bonded to the base 3 by a bump 71 for the base, and the crystal vibration chip 2 is bump-bonded to the support material 5 by a bump 72 for the crystal vibration chip. In the crystal vibrator 1, at least one of the bonding part 51 of the support material 5 with the crystal vibration chip 2 and the bonding parts 261 and 262 of the crystal vibration chip 2 with the support material 5 is composed of a rugged shape. COPYRIGHT: (C)2009,JPO&INPIT
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