发明名称 |
PERFORMANCE ENHANCING CONTACT MODULE ASSEMBLIES |
摘要 |
A contact module assembly includes a dielectric body having a mating end with a plurality of mating contacts and a mounting end with a plurality of mounting contacts. A lead frame is at least partially encased by the dielectric body, wherein the lead frame has a plurality of conductors representing both signal conductors and ground conductors extending alone a lead frame plane. The signal and ground conductors extend from respective ones of the mating contacts and the mounting contacts, wherein at least some of the ground conductors include a mating contact terminal proximate the respective mating contact and a mounting contact terminal proximate the respective mounting contact. The ground conductors extend only partially between the mating contact and the mounting contact associated with the respective ground conductor such that a gap exists between the mating contact terminal and the mounting contact terminal of the ground conductor. A commoning member electrically connects the mating contact terminal and the mounting contact terminal of at least one of the ground conductors, wherein the commoning member is oriented in a non-coplanar relation with the lead frame plane.
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申请公布号 |
US2009093158(A1) |
申请公布日期 |
2009.04.09 |
申请号 |
US20070869417 |
申请日期 |
2007.10.09 |
申请人 |
MCALONIS MATTHEW RICHARD;SIPE LYNN ROBERT;FEDDER JAMES LEE;ROTHERMEL BRENT RYAN;GLOVER DOUG W |
发明人 |
MCALONIS MATTHEW RICHARD;SIPE LYNN ROBERT;FEDDER JAMES LEE;ROTHERMEL BRENT RYAN;GLOVER DOUG W. |
分类号 |
H01R13/648 |
主分类号 |
H01R13/648 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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