| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhered section structure for a non-contact IC label and an adherend for the non-contact IC label, in which an IC chip mounted on the non-contact IC label is hardly damaged and the upper face of the adhered non-contact IC label is made flat. <P>SOLUTION: The adhered section structure 1 of a non-contact IC label is provided to which a non-contact IC label 3 equipped with an IC chip 6 capable of performing data communication with an external reading device without contact and an OVA section with a conductive layer made of conductive materials and functioning as the antenna of the IC chip 6 is adhered. The adhered section structure 1 is equipped with an adhered face 11 to which a non-contact IC label 3 is adhered and a recess section or a through-hole formed on the adhered face 11, and shaped so that the IC chip 6 can be stored inside when viewed in plane, and equipped with depth which is larger than the thickness of the IC chip 6. <P>COPYRIGHT: (C)2009,JPO&INPIT |
