发明名称 POSITIVE RESIST COMPOSITION, AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition having good sensitivity and pattern formation in normal exposure, liquid immersion exposure and double exposure, and to provide a pattern forming method using the positive resist composition. <P>SOLUTION: The positive resist composition contains (A) a compound generating acid by irradiation with active light or radiation, (B) a resin having a repeating unit having a non-acid leaving hydrocarbon group of a specific structure and increasing solubility to alkali developing solution by action of acid, and (C) a compound decomposed by action of acid and generating acid. The pattern forming method using the positive resist composition is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009075428(A) 申请公布日期 2009.04.09
申请号 JP20070245333 申请日期 2007.09.21
申请人 FUJIFILM CORP 发明人 WADA KENJI
分类号 G03F7/039;C08F220/12;G03F7/11;H01L21/027 主分类号 G03F7/039
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