| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which has high mounting yield and is superior in mounting property and mounting reliability by effectively preventing a solder bridge between adjacent external connection terminals after solder mounting of a semiconductor device having a semiconductor package mounted on a mounting substrate, the mounting substrate mounted therewith, and the semiconductor device. SOLUTION: The semiconductor package 101 is a semiconductor package provided with a plurality of external connection terminals 103 on one surface, and is provided with a wall type member 151 enclosing part or the whole of a circumference of at least one of the external connection terminals. COPYRIGHT: (C)2009,JPO&INPIT
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