| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical property analysis system of a multilayer circuit substrate capable of obtaining the voltage, current and impedance of the multilayer circuit substrate even when the mesh size in modeling does not meet the size of a via. SOLUTION: Since this substrate analysis device can analyze a wiring pattern using correction model data for canceling the difference between an electrical parameter when assuming that current may have flowed from the surrounding plane toward the via and an electrical parameter in a mesh model, the wiring pattern including the via can be properly analyzed even when using a mesh with a larger size in relation to the diameter of the via. COPYRIGHT: (C)2009,JPO&INPIT
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