Assembly and method of assembly by brazing of an object and a support

摘要

The assembly of an optical or optoelectronic object (401) and a support (402) e.g. microelectronic platform, comprises wetted regions formed on the object and the support. The object and the support are assembled by solder balls (403) that provide electrical contact and mechanical fixing of one part with the regions and other part with the support. Melting temperature of the solder balls is lower than a melting temperature of the wetted regions. Each wetted region of the object and the support forms an angle of 90[deg] . Lower part of the object is received in a cavity produced in the support. The assembly of an optical or optoelectronic object (401) and a support (402) e.g. microelectronic platform, comprises wetted regions formed on the object and the support. The object and the support are assembled by solder balls (403) that provide electrical contact and mechanical fixing of one part with the regions and other part with the support. Melting temperature of the solder balls is lower than a melting temperature of the wetted regions. Each wetted region of the object and the support forms an angle of 90[deg] . Lower part of the object is received in a cavity produced in the support. The lower edge of the object is distant from the bottom of the cavity. The solder balls have different dimensions. The wetted region has a stack of layers made of materials. An independent claim is included for a process for assembling an object on a support using a soldering material.