| 摘要 |
<p>IC card (30) comprising a plated module (30) including a printed circuit (2) comprising a plurality of conductive areas (a 1 ,..,a n ), delimited by a network of insulating channels (ch 1 ,..,ch k ), for covering an integrated circuit chip (3), a plastic support (1) with a recess (6) intended to host the plated module (30) and the integrated circuit chip (3), being at least some of the conductive areas (a 1 ,..,a n ) connected to a corresponding contact points (c 1 ,..,c j ) on the integrated circuit chip (3). A plurality of extended areas (ea 1 ,..,ea m ) are linked to a corresponding conductive areas (a 1 ,..,a n ) by one or more bridges (br 1 ,.., br l ). A couple of advanced extended areas (ea 1 ,ea m ) form a rounded border of the plated module (20). Advanced extended areas (ea 1 ,ea m ) are linked to conductive areas (a 1 ,a n ) not connected to contact points (c 1 ,..,c k ). Advanced extended areas (ea 1 ,ea m ) wrap around the extended areas (ea 1 ,ea m ), and form the opposite rounded sides of the plated module (20).</p> |
